V-ALPHA-050
← Energy Fluence
Sequence 07

Thermal Diffusion (k)

Material conductivity (k) limits the ultimate resolution of a mark. On high-conductive materials like Copper, heat travels laterally—blurring your edges before you can even finish the line.

Act I: The Bug

The "Heat Bleed" Blob (Copper)

Scan Speed 100 mm/s
Conductivity (k)
400 W/m·K
Edge Definition
Blurry
The Failure: Copper is an excellent thermal conductor. At low speeds, the material pulls heat away from the spot so fast that it melts the neighborhood instead of just the point. This lateral diffusion ruins sharp edges.
Act II: The Fix

High-Speed Gating (Sharpness)

Scan Speed 2000 mm/s
Lateral Bleed
0.01 mm
Resolution
High
The Success: To mark Copper cleanly, you must move the laser faster than the heat can travel. High-speed gating (2000mm/s+) dumps energy so quickly that the material has no time to conduct it laterally before the mark is frozen.